ASSEMBLY AND PACKAGING
The technologies for Assembly and Packaging optical circuits are critical to making the results of photonics research usable.
Among its capabilities, the University Institute of Nanophotonic Technology has its own assembly and coupling infrastructure.
The main objective of this laboratory is the development of back-end and packaging technologies for components in photonics, optoelectronics, mems, moems, sensors and LED/OLED.
Assembly and packaging technologies can be applied in research, prototyping and packaging engineering in telecommunications, data communications, biotechnology, environment, microelectronics and space applications.
Furthermore, we also focus on packaging design using software that includes optical, thermal and mechanical simulations (AutoCAD, SolidWorks, Comsol, Zemax).