ASSEMBLY AND PACKAGING

The technologies for Assembly and Packaging optical circuits are critical to making the results of photonics research usable.​
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Among its capabilities, the University Institute of Nanophotonic Technology has its own assembly and coupling infrastructure. ​
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The main objective of this laboratory is the development of back-end and packaging technologies for components in photonics, optoelectronics, mems, moems, sensors and LED/OLED.​
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Assembly and packaging technologies can be applied in research, prototyping and packaging engineering in telecommunications, data communications, biotechnology, environment, microelectronics and space applications.​
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Furthermore, we also focus on packaging design using software that includes optical, thermal and mechanical simulations (AutoCAD, SolidWorks, Comsol, Zemax).​