SPIN COATING

Resist is a polymer suspended in a solvent. Depending on the type of resist, it can be selectively removed using UV light or an electron beam. All resists can be broadly categorized as positive or negative resist, with positive being the most common. In a positive resist, the area exposed is removed after developing the resist. In a negative resist, the area exposed is remains after developing the resist. Different types of lithography use different types of resists, so you will need to check what resist is appropriate for your process.

Back to processes

SPIN COATING EQUIPMENT

COATER EVG101​

SEE MORE

COATER OBDUCAT​

SEE MORE

Spin coating system.
EVG101 by EVG

The EVG101 spin coating system performs automated spin or spray resist coating or developing with manual wafer load/unload. Versatile programmable steps together with the possibility of syringe dispense system ensure low material consumption while improving uniformity and resist spreading options.

Semi-automated system:

  • manual wafer loading with mechanical prealignment
  • wafer edge bead removal
  • programmable dispense and  automatic bowl wash

Substate size:

4-6 “ wafer

Max speed/ramp up speed:

10000/40000 rpm

SEE MORE EQUIPMENT

COATER OBDUCATAVAILABLE SOON

The Quickstep QS S 200 SMS spinner system is a stand-alone spin-coater system for wafers of 4”, 6” and 8” clamped with vacuum chucks with centering pins. It allows to deposit the resists used for all the lithography processes.

SEE MORE EQUIPMENT