EQUIPMENT

  • Wet Benches and Dry Rinse Spinner: FSI Mercury reactor, SEMITOOOL organic solvent system
  • 4-tube Furnance (including LPCVD)
  • Conventional & Rapid Thermal Annealing
  • Deposition of Polysilicon and Dielectric Layers with precise refractive index control: 2 PECVD Applied Materials cluster tools (a-Si:H, Si3N4, TEOS-based B&P doped glasses)
  • Resist spinner, develop track and high pressure spray lift-off system
  • Lithography: Raith 150 e-Beam direct writing, Nikon I-Line stepper, TEL Mk VZ Developer, TEL Mk VZ Coater.
  • Dry Etching systems (RIE, ICP)
  • Physical Vapor Deposition (PVD) systems
  • Metrology: Hitachi SEM for x-section analysis of small samples, JEOL FIB for x-section analysis of 6” wafers.
  • Ion implanter

 

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