EQUIPMENT

  • Flip Chip bonder SET FC150
  • Ball bumper PACTECH model SB2-M
  • Die-attach FINETECH model PICO MA
  • Wire Bonder TPT model HB16
  • Dicing line DISCO model DAD3350
  • Reflow vacuum oven ATV model SR714
  • 2 Alignment and Pigtailing Benches 15 axes Micos
  • Splicer FUJIKURA (PM fibers)
  • Stereo, metallographic microscopy and SEM
  • 1 Chemical Hood
  • Seam sealing equipment PYRAMID
  • Climatic Chamber ESPEC model EGNX12-6CAL
  • Pull-shear tests XYZTEC model Condor EZ
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